Thermal Interface Materials

High-purity indium foils feature tightly controlled impurity levels, excellent ductility and high thermal conductivity. They conform closely to microscopic irregularities between devices and substrates to greatly reduce interfacial thermal resistance. Custom thicknesses and outlines are available, and selected grades can be supplied with laminated flux, delivering dual functions of thermal conduction and solder interconnection.

Suitable for high heat-flux-density devices such as CPUs, GPUs, IGBTs, SiC power modules and optical modules, they are compatible with vacuum reflow, thermocompression bonding, low-temperature soldering and other processes. As an alternative to thermal greases and thermal pads, they carry no risk of silicone bleed-out or drying degradation and possess outstanding long-term thermal stability. They meet stringent thermal management and reliability requirements for automotive, computing and advanced semiconductor packaging, providing a high-performance domestic thermal interconnection solution.