Manufactured from eco‑friendly tin‑silver‑copper and tin‑copper alloys with evenly distributed embedded flux core, lead‑free solder wire contains no hazardous substances such as lead. It delivers stable melting and wetting performance, and meets requirements for manual soldering, touch‑up soldering of miniature components and terminal tinning.
Key Features
Eco‑friendly & Regulatory‑compliant
Lead‑free formulation complies with RoHS and REACH environmental regulations, suitable for manufacturing of various export‑oriented electronic products.
Superior Wetting Performance
Embedded active flux rapidly removes oxide layers and achieves uniform, full tin deposition, minimizing cold solder joints and missing solder.
Excellent Mechanical Performance of Solder Joints
High tensile strength and strong thermal‑shock resistance make it suitable for demanding service conditions with large temperature fluctuations, such as automotive and new‑energy applications.
Comprehensive Specifications & User‑friendly Operation
A wide selection of wire diameters is available with moderate melting flow rate. Compatible with various soldering‑iron temperature settings, it works well for both small‑batch rework and mass‑production.
Quickly browse products and applications. VisitProduct Centerfor matching inquiries.