Solder Preforms

Preformed solders are fabricated by precision stamping of high-purity alloys, with a wide selection of tin-based and indium-based alloy systems. Thickness and form tolerances are tightly controlled, and products can be supplied with laminated flux. Upon soldering, a uniform and continuous solder layer is formed for robust interfacial stability.

Our standard portfolio covers a full range of specifications including solder preforms, solder ribbons, solder rings, solder pellets and custom irregular preforms.

Widely deployed in the packaging of power semiconductors such as IGBTs, TO packages, ceramic packages and SiP devices, these products are compatible with advanced processes including vacuum reflow and thermocompression bonding. Custom irregular and ultra-thin formats are available. They effectively reduce soldering voids and enhance long-term device reliability, delivering a mature, stable domestic alternative for high-demand power packaging applications.