Solder Wire

Rigorous impurity control coupled with a proprietary anti-oxidation formulation delivers outstanding wettability and clean, consistent solder joint formation. It supports flux-free soldering for automated die attach wiring, while also functioning as conventional solder wire.

Primarily deployed for die attach of IGBTs, TO packages and optical devices, it can also be used as standard solder wire for manual PCB rework and small-batch soldering. Tailored for high-reliability packaging of power devices, it features high joint strength and superior fatigue resistance. It cuts additional auxiliary material investment on production lines, suited for both automated manufacturing and laboratory repair scenarios.