High-purity alloy powder combined with our self-developed flux system delivers stable printability and superior wettability. It enables precise void rate control, suits fine-pitch components, and covers a full spectrum of applications including SMT assembly, semiconductor die attach and formic acid vacuum soldering.
Engineered for automotive electronics, power devices, optical modules, advanced packaging and other sectors, we offer a complete portfolio of no-clean and water-soluble solutions. Customization is available for alloy compositions and powder particle sizes, matching the performance of leading international brands. Consistent batch-to-batch uniformity helps customers mitigate process variation, sustain higher production yields, drastically shorten material qualification cycles and reduce overall manufacturing costs.
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