Formic acid reflow leverages the reducing property of formic acid atmosphere to remove surface oxides of base materials with no extra flux or minimal flux, achieving clean metallurgical solder interconnection. It serves as a distinctive process route for high-end packaging of power devices, optical components and SiP modules, and directly determines interfacial bonding quality, void level and long-term device reliability.

Industry Challenges & Solutions 

Formic acid reflow imposes strict requirements on solder materials regarding high-temperature oxidation resistance and residue control. Issues such as re-oxidation, excessive voids and contamination from decomposed formic acid by-products are prone to occur during processing. 

Huaqing provides formic-acid-compatible solder pastes, solder preforms and dedicated fluxes with rigorous impurity control and superior high-temperature stability. They effectively suppress re-oxidation and facilitate low-void interfacial soldering to meet high-cleanliness packaging requirements for vacuum formic acid reflow.