Advanced Packaging

Advanced packaging leverages heterogeneous integration and high-density interconnection technologies to break the performance limits of single dies. It integrates multiple chips and passive components within a limited footprint to boost bandwidth, computing power and integration density. It is the critical enabler for high-performance chips to deliver full performance. Packaging processes and solder material quality directly govern signal integrity, thermal dissipation capability and long-term product reliability.

Industry Challenges & Solutions

Characterized by fine pitch, microbumps and multi-interface stacking, advanced packaging is prone to micro-voids, interfacial oxidation, flux residue, thermal-stress-induced deformation and interconnection impedance drift. It imposes stringent requirements on solder purity, wettability, low-residue performance and thermal stability. 

Huaqing offers high-purity solder pastes, precision solder preforms, dedicated low-residue fluxes, pure indium thermal foils and eco-friendly cleaners. Compatible with vacuum reflow, formic acid atmosphere processing, TCB thermocompression bonding and wafer bumping, our materials precisely control interfacial soldering quality to meet the requirements of high cleanliness, low voids and high reliability for high-density stacked packaging.