TCB (Thermocompression Bonding) forms robust metallic interconnections on microbump interfaces through precisely coordinated thermal and pressure control, establishing electrical conduction and mechanical bonding between fine-pitch, high-density chips and substrates. It serves as a core process for high-density interconnection scenarios including HBM, Chiplet and photonic chip integration, and directly governs bonding yield, impedance consistency and long-term module stability.

Industry Challenges & Solutions 

The ultra-narrow gaps between microbumps in TCB processes are susceptible to surface oxidation, insufficient wetting, hard-to-remove flux residue, bridging and interfacial voids, imposing stringent requirements on solder material cleanliness and low-residue performance. 

Huaqing offers TCB-dedicated solder pastes, solder preforms and low-residue fluxes compatible with vacuum and formic-acid TCB processes. They ensure adequate wetting of microbumps and mitigate residue contamination, supporting customers to achieve high-yield, high-density microbump bonding.